The
organizing committee calls you to submit your papers,
special sessions and tutorials.
Plenary Lecture 1:
Plenary Lecture 2:
 |
Non-traditional Approach to Computer Energy Reduction by Prof. Vasily G. Moshnyaga, Fukuoka University, Japan. |
Plenary Lecture 3:
 |
Combining Virtual and Augmented Reality to Improve the Mechanical Assembly Training Process in Manufacturing by Prof. Amaury Andres Peniche Gonzalez, EAFIT University, Colombia. |
Plenary Lecture 4:
 |
Create a Self-Modeling DSS in the Cloud: Perspectives, Methodologies and Case Studies by Prof. Roberto Revetria, University of Genoa, Italy. |
Plenary Lecture 5:
 |
A Long-Term Information Service for Professional Development by Prof. Lung-Hsing Kuo, National Kaohsiung Normal University, R.O.C. |
INDEXES:
The Proceedings related to the Conference are covered by:
1. ISI (ISINET)
2. INSPEC (IET, former IEE)
3. CSA (Cambridge Scientific Abstracts)
4. ELSEVIER and Elsevier Bibliographic Database
5. ZENTRALBLATT
6. ULRICH
7. MATHSCINET of AMS (American Mathematical Society)
8. MATHEMATICAL REVIEWS of AMS (American Mathematical Society)
9. Directory of Published Proceedings
10. Computer Science Bibliography Administrator
11. American Chemical Society and its Index: Chemical Abstracts Service
12. European Library in Paris (France)
13. DEST Database (Australia)
14. Engineering Information
15. SCOPUS
16. EBSCO
17. EMBASE
18. Compendex (CPX)
19. GEOBASE
20. BIOBASE.
21. BIOTECHNOBASE
22. FLUIDEX
23. OceanBase
24. BEILSTEIN Abstracts
25. World Textiles
26. MEDLINE
27. British Library
28. National Library of Greece
29. German National Library of Science and Technology
30. IARAS Index
JOURNALS:
BEST PAPERS: The authors of the Best Papers will be invited to send extended versions of their papers after the conference to the International Journals. These extended versions might be published in the International Journals after the conference and after undergoing additional review. This very limited number of high-quality papers will be announced in the Post-Conference report of the Conference.
No-show authors will be excluded from any further publication in International Journals, regardless of the quality of their papers. Additionally, they will be required to pay extra shipping and handling fees in order for the organizing committee to mail out their registration receipt, CD-ROM proceedings, and one volume of the hard-copy proceedings.
These journals are covered by:
1. ISI through the INSPEC (IEE)
2. INSPEC (IET, former IEE)
3. CSA (Cambridge Scientific Abstracts)
4. ELSEVIER and Elsevier Bibliographic Database
5. ZENTRALBLATT
6. MATHSCINET of AMS (American Mathematical Society)
7. ULRICH
8. MATHEMATICAL REVIEWS of AMS (American Mathematical Society)
9. Computer Science Bibliography Administrator
10. British Library
11. American Chemical Society and its Index: Chemical Abstracts Service
12. European Library in Paris (France)
13. DEST Database (Australia)
14. Swets Information Services
15. Engineering Information
16. SCOPUS
17. EBSCO
18. EMBASE
19. Compendex (CPX)
20. Geobase
21. BIOBASE
22. BIOTECHNOBASE
23. FLUIDEX
24. OceanBase
25. BEILSTEIN Abstracts
26. World Textiles
27. MEDLINE
28. Mayersche
29. Index of Information Systems Journals
30. National Library of Greece: See the link: NLG-Journals
31. IARAS Index
BEST PAPER
COMPETITION:
WSEAS will give out prizes to the winners of the best
paper competition. The evaluation will be based on the
recommendations of the Chairmen of each Session as well
as the recommendations of the Committee of 6
international experts. See the best papers of recent
WSEAS conferences at: www.wseas.org/reports
HISTORY
OF THIS WSEAS CONFERENCE:
2000: Vravrona,
Attica, Greece
2001: Cairns, Australia
2002: Miedzyzdroje, Poland
2003: Malta
2004: Miami, Florida, USA
2004: Corfu, Greece
2005: Cancun, Mexico
2005: Tenerife, Spain
2006: Istanbul, Turkey
2006: Dallas, Texas, USA
2007: Dallas, Texas, USA
2007: Cairo, Egypt
2008, University of Harvard, USA
2008: Tenerife, Spain
2009: Houston, USA
2010: Harvard, USA
2011: Puerto Morelos, Mexico
Benefits of Attending:
